Principal Module Process Development Engineer

Recruiter
Anonymous
Location
Birmingham
Salary
53700.00 - 53700.00 GBP Annual + GBP53700/annum
Posted
14 Oct 2019
Closes
11 Nov 2019
Contract Type
Permanent
Job title:

Contract: Permanent

Salary: Competitive

Working hours: Hours: 9:00 - 18:00 Mon -Thurs and 09:00 -15:00 on a Fri (1hour unpaid lunch).

Reference: 3-6

The Role

This role will be responsible for power device packaging process development, in charge go the manufacturability design of power semiconductor module, including soldering process, USW process, wire bonding, gel filling.

Benefits

TEIC is a great place to work with opportunities for professional and personal development. Our benefits include:

?? 25 days holiday + 8 bank holidays

?? Holiday allowance increase with length of service

?? Bupa healthcare

?? Free on site car parking

?? Free lunch Monday to Friday

?? Contributory Pension

?? Life assurance

?? Cycle to work scheme

?? Company sick pay

?? Professional Membership fees paid e.g. CIPD, IEEE

?? Family Friendly policies

?? An Independent 24-hour confidential counseling service

Key responsibilities

?? Responsible for the manufacturability design and review, including but not limit die attaching, soldering, wire bonding, USW, gel filling.

?? Responsible for soldering process of power device packaging, to ensure the normal production of the soldering process

?? Debug and optimize the soldering process to guarantee the soldering process meet the required specifications

?? Participate in new packaging process development, such as soldering, silver sintering, TLP, etc., and promoting product implementation.

?? Solve the existing process problem in production, improve yield and analyse defective products.

?? Responsible for the formulation and implementation of the process test plan;

?? Development of equipment required for the packaging process;

?? Assist structural engineers to design and process welding fixtures;

?? Define working documents such as job instructions, inspection standards, equipment maintenance specifications, and related training for operators.

Core Skills and Education

?? A Degree or equivalent in a microelectronics, semiconductor, physics, materials and other related subjects;

?? At least 7 years of experience in R&D of power device packaging process

?? Solid background in power device packaging process, microelectronics, semiconductor physics, and materials science.

?? Familiar with various packaging processes and equipment

?? Familiar with reflow soldering process

?? Familiar with quality analysis and process solutions of various soldering products of power module

?? Understand the failure analysis of the power module

?? Know about Solid Edge or other 3D design software

?? Understand the working principle and application of power devices

If you are interested in this exciting opportunity please apply now!

The Role

This role will be responsible for developing and maintaining AUTOSAR code for different projects, participating architecture design of hardware and software. This role will also be responsible for the AUTOSAR software development of the next generation based on the functional safety requirements.

Key responsibilities

?? Leading and participating in software architecture design

?? Leading evaluation of different processor platforms, different hardware architecture designs

?? Leading evaluation of functional safety solutions, and ASIL decomposition solutions

?? Leading development of peripheral drivers, generating AUTOSARmiddleware and debugging code

?? Integration of basic software, third-party MCAL, algorithm software and OEM software, provision of complete AUTOSAR compliant control software

?? Making plans and monitoring progress for software integration and testing

?? Writing technical documentation

?? Actively corporate with other colleagues, organize meetings to discuss critical issues, update and progress in time with the awareness of timeline

?? Teamwork with control engineer and embedded software engineer to specify hardware and software architecture, provide complete middleware and testing plan

?? Support functional safety engineer to evaluate functional safety performance of control hardware

?? To maintain effective working relationship with core members, guarantee efficient circulation of technical information among departments

?? Actively communicate with external suppliers, universities, research institutes and clients, keep in line with the cutting-edge technology and future trending technology

Core Skills and Education

?? Minimum Bachelor's degree in electronics/ electronics related discipline, 5 years and above working experience in the area of embedded software development and testing in automotive industry

?? Robust experience with AUTOSAR 3.0 or 4.0 standard

?? Experience with software architecture design tool like Rhapsody, PREEVision and etc.

?? Familiar with NXP or Infineon processors

?? Familiar with Tasking, GHS or Code warrior compilers

?? Familiar with SPI, CAN, FlexRay or Ethernet and LLD

?? Familiar with RTOS

?? Analog and digital circuit

?? Familiar with XCP protocol and diagnosis protocol

?? Familiar with safety critical code standard like MISRA C

?? Excellent embedded C programming and assembly programming techniques

?? Familiar with ISO26262

?? Familiar with V model software testing process and version control

?? Familiar with requirements management tool like DOORS etc

?? Experience with functional safety software like Medini

?? SysML/UML modelling

?? FMEA awareness will be desirable

If you are interested in this exciting opportunity please apply now!

Your CV will be forwarded to Jonathan Lee Recruitment, a leading engineering and manufacturing recruitment consultancy established in 1978. The services advertised by Jonathan Lee Recruitment are those of an Employment Agency